3410±20℃ Tungsten Products Target For Vacuum Sputtering Coating Tungsten Target Tungsten Round Plate Target W Plate

3. Features Of Tungsten Target For Vacuum Sputtering Coating:

1) High purity; the target's purity can typically reach greater than 99.95% after sintering and forging. The higher the target material's purity, in general, the better the coating's electrical qualities and the less probable it is that the related circuit will be shorted out or damaged, provided that other factors remain constant.

2) Direct pressing using powder metallurgy may be done more quickly and at a relatively fair cost, which can save cost by shortening the production cycle.

3) High density; after sintering and forging, the desired density may exceed 19.3g/cm3.

4) The finished target made from ultra-fine pure tungsten powder has a high deflection strength and a generally homogeneous and consistent composition.

5) Excellent thermochemical stability; resistant to volume contraction or expansion, chemical reactions with other compounds, etc.

6) The resistance is low and will not make the circuit generate unnecessary energy.

Additionally, it is non-toxic and non-radioactive, and it has a high melting point, high elasticity, low expansion coefficient, and low vapor pressure.

4.Chemical composition Of Tungsten Target For Vacuum Sputtering Coating:

Please click below button for learn more our products.